Simplification is Our Innovation
IMP stands for Interconnect Micro-miniature Pressure. The latest IMP connectors and contacts provide innovative solutions which meet the needs of miniaturization and space constraints for board-to-board and board-to-modules applications. These new solderless products provide increased integration density, lighter interconnection and an easy implementation. They also offer a high degree of flexibility in the design of applications thanks to their modularity.
The IMP family is composed of different product design to suit a variety of applications from Military to Telecom, including New Space market: