A Family of Miniature Connectors for the Defense Industry

Radiall's IMP (Interconnect Micro-miniature Pressure) Family of connectors offers innovative solutions to meet the high-performance demands of modern technology. From radar systems to advanced antennas, the IMP connectors are designed to enhance efficiency and reliability while simplifying installation and maintenance processes.

3 Problems the IMP Family Can Solve

1. Signal Integrity and Performance

High-frequency applications often suffer from signal loss, phase noise and crosstalk, which can degrade performance. The IMP Family supports frequencies up to 40 GHz with low insertion loss (≤ 0.25 dB) and low phase noise (-20 to -30 dB @ 1 kHz), ensuring minimal signal distortion.

2. Installation and Maintenance Complexity

Traditional connectors often require soldering, which can be labor-intensive, time-consuming and prone to errors. The IMP Family features a solderless design, which simplifies installation and maintenance. This eliminates the need for soldering, reducing installation time and associated costs.

3. Space Constraints

Many applications, especially in aerospace and defense, require compact and lightweight components due to limited space and weight restrictions. Radiall’s IMP connectors have a small form factor with diameter starting from 2.52 mm and can adapt to board-to-board distances ranging from 1.41 mm  to 37 mm. The compact design allows for increased integration density, helping customers maximize the use of available space without compromising on performance.

The IMP Family’s Comprehensive Product Range

The IMP family includes a variety of models to address different needs:

• IMP-HD: Featuring a low phase noise option
• IMP-LP: Offered in simple, double and hybrid versions
• IMP-SR: For RF, data and signal interconnection

Features and Benefits of the IMP Family

• High Frequency Range: Up to 40 GHz
• Low Phase Noise: -20 to -30 dB @ 1 kHz
• Low Insertion Loss: ≤ 0.25 dB
• Crosstalk Performance: -85 dB typ. @ 18 GHz
• Compact Design: Small form factor with diameter from Ø 2.52 mm and adaptable board-to-board distances from 1.41 mm to 37 mm

By embracing miniaturization and enhancing performance, the IMP Family meets the stringent demands of modern applications, offering a reliable, efficient and cost-effective solution for a wide range of industries. To discuss your specific application, book a virtual meeting with a Radiall expert today.